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BGA134 BGA200 BGA60 BGA168 BGA178 BGA136 BGA Stencil IC
Reballing Stencil Template BGA134/BGA200/BGA/BGA60/BGA168/BGA178/BGA136 for iPhone CPU motherboard soldering repair.
Features:
1. High quality tin reballing steel mesh.
2. Special design: Ultra-thin steel net, easy to use.
3. BGA reballing stencil for iPhone CPU motherboard soldering repair.
4. Inspiration comes from the actual experience of mobile phone repair engineer, make a good repair tool belonging to mobile phone repair master.
Features:
1. High quality tin reballing steel mesh.
2. Special design: Ultra-thin steel net, easy to use.
3. BGA reballing stencil for iPhone CPU motherboard soldering repair.
4. Inspiration comes from the actual experience of mobile phone repair engineer, make a good repair tool belonging to mobile phone repair master.
$1.05
Original: $2.99
-65%BGA134 BGA200 BGA60 BGA168 BGA178 BGA136 BGA Stencil IC—
$2.99
$1.05Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Reballing Stencil Template BGA134/BGA200/BGA/BGA60/BGA168/BGA178/BGA136 for iPhone CPU motherboard soldering repair.
Features:
1. High quality tin reballing steel mesh.
2. Special design: Ultra-thin steel net, easy to use.
3. BGA reballing stencil for iPhone CPU motherboard soldering repair.
4. Inspiration comes from the actual experience of mobile phone repair engineer, make a good repair tool belonging to mobile phone repair master.
Features:
1. High quality tin reballing steel mesh.
2. Special design: Ultra-thin steel net, easy to use.
3. BGA reballing stencil for iPhone CPU motherboard soldering repair.
4. Inspiration comes from the actual experience of mobile phone repair engineer, make a good repair tool belonging to mobile phone repair master.
