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IC Chip Thin Blade BGA Glue Remove Knife For iPhone CPU Disassemble
5 in 1 IC Chip Repair Thin Blade CPU NAND Remover BGA Maintenance Knife Remove Glue Disassemble Phone PC Rework Processor Tools.
Features:
1. Professional repair tool set for iPhone CPU disassemble.
2. For BGA repair,dismantling phone CPU chip and phone repair.
3. It can be used to separate the welding spot.
$1.09
IC Chip Thin Blade BGA Glue Remove Knife For iPhone CPU Disassemble—
$1.09
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
5 in 1 IC Chip Repair Thin Blade CPU NAND Remover BGA Maintenance Knife Remove Glue Disassemble Phone PC Rework Processor Tools.
Features:
1. Professional repair tool set for iPhone CPU disassemble.
2. For BGA repair,dismantling phone CPU chip and phone repair.
3. It can be used to separate the welding spot.
