JTX DP-4 Special Blade Set with 4 different blades for mobile phone repair, such as phone PCB CPU IC glue removal, CPU Nand IC prying, edge glue cutting, black glue removal without damaging the mobile phone motherboard. High carbon elastic steel, high hardness, corrosion resistance, high temperature resistance, durable and wear-resistant. 

Features:
1. Fine high carbon elastic steel, high hardness, corrosion resistance, high temperature resistance, durable and wear-resistant.
2. One set multiple repairs, multiple sizes available: 4 A blades, 4 B blades, 4 C blades, 4 D blades, 1 each of ABCD.
3. Strong toughness, no deformation, rigid and flexible, not damage board, rebound without deformation.
4. A style professional side glue removal tools, the tip is thin and hard enough. Easy to cut rubber, not easy to deform.
5.  B style Android CPU/EMMC and other chip warp knife (hard) easy insertion and smooth removal.
6. C style soft warp knives better suited for Apple CPUs and other chips good blade tough.
7. D style no damage to the board, silky smooth spatula glue in a single stroke, smooth and rounded. No damage to the bottom of the board cutting vinyl.