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RF1 RF2 AMAOE Chip BGA Reballing Stencil For Phone Amplifier RF IC
Amaoe RF1 RF2 BGA Stencil 77031 QPM5677 53735 78191-11 Power Amplifier IC Chip Reball IC Pin Solder Heat Tin Plant Net Steel Mesh.
Features
1. Brand New.
2. BGA stencil for reballing pins for Amaoe RF1 BGA Stencil 77031 QPM5677 53735 78191-11 Power Amplifier IC Chip Reball IC Pin Solder Heat Tin Plant Net Steel Mesh
Advantage:
1. Deformation resistant material
2. Precise pins locatio
3. Square round hole
4. Good material
Features
1. Brand New.
2. BGA stencil for reballing pins for Amaoe RF1 BGA Stencil 77031 QPM5677 53735 78191-11 Power Amplifier IC Chip Reball IC Pin Solder Heat Tin Plant Net Steel Mesh
Advantage:
1. Deformation resistant material
2. Precise pins locatio
3. Square round hole
4. Good material
Select option
From $0.89
Original: $2.55
-65%RF1 RF2 AMAOE Chip BGA Reballing Stencil For Phone Amplifier RF IC—
$2.55
$0.89Product Information
Product Information
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Shipping & Returns
Description
Amaoe RF1 RF2 BGA Stencil 77031 QPM5677 53735 78191-11 Power Amplifier IC Chip Reball IC Pin Solder Heat Tin Plant Net Steel Mesh.
Features
1. Brand New.
2. BGA stencil for reballing pins for Amaoe RF1 BGA Stencil 77031 QPM5677 53735 78191-11 Power Amplifier IC Chip Reball IC Pin Solder Heat Tin Plant Net Steel Mesh
Advantage:
1. Deformation resistant material
2. Precise pins locatio
3. Square round hole
4. Good material
Features
1. Brand New.
2. BGA stencil for reballing pins for Amaoe RF1 BGA Stencil 77031 QPM5677 53735 78191-11 Power Amplifier IC Chip Reball IC Pin Solder Heat Tin Plant Net Steel Mesh
Advantage:
1. Deformation resistant material
2. Precise pins locatio
3. Square round hole
4. Good material
