Optical alignment system BGA rework station WDS-700. WDS-700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after-sales service and rework.

How to separate BGA chip from motherboard / How to replace a new BGA chip

Repair steps : 

1. Separate the BGA chip from mother board -we called desoldering
2. Clean Pad
3. Reballing or replace a new BGA chip directly
4. Lignment/Positioning -Depend on experience ,silk frame ,optical camera
5. Replace a new BGA chip - we called Soldering

User manaul and technical parameters : 

https://drive.google.com/file/d/1YPxRbdjkTAQIHVKoBLdJozCTU79koMJy/view?usp=sharing