XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone A8-A16 Qualcomm MTK Hisilicon CPU tin planting. XZZ L23 BGA Reballing Stencil Platform for iPhone 6 to 14 Pro Max A8 A9 A10 A12 A13 A14 A15 A16, Qualcomm, MTK, Hisilicon CPU IC soldering repair. 

Features:

1. Magnetic power positioning with strong magnetic force and automatic alignment.
2. Built-in powerful magnets with strong adsorption for easy pick up and fast maintenance.
3. Easy to operate stable clamping, with automatic clamping and flexible full pull.
4. Synthetic stone base that is green and environmentally friendly with high-temperature resistance, high strength, dirt resistance and easy to clean.
5. Tin-plating table with environmentally friendly rubber feet that are wear-resistant, anti-skid, shock absorbent, anti-pressure, anti-aging, non-toxic, tasteless, and high-temperature resistant.
6. Imported alloy steel that provides metal fatigue resistance, making the product more durable.
7. Precise alignment that ensures the accuracy of the solder joints.
8. Square holes and rounded corners for planting tin and black nets to make each tin ball more rounded and fuller.
9. Rigid and flexible with the ability to maintain the flexibility of the steel and easily restore it to its original shape.
10. High precision with no burrs and every mesh of the same size, ensuring that they do not stick.
11. Double magnet with super magnetic force and accurate positioning without shaking.

Support Model:

1. Qualcomm: 765G, 778G, 845, 855, 865/870, 888/888 Plus, 8 Gen1, 8+ Gen1, 8 Gen2
2. MTK: 720, 800, 810, 900, 1000, 1100, 9000, 9200
3. Hisilicon: 710, 960, 970, 810, 980, 820/985, 990, 9000
4. iPhone: A8, A9, A10, A11, A12, A13, A14, A15, A16

Package includes:

• 1 x Tin Planting Platform