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XZZ Lead Free Tin Paste 138/158/183/199ā Solder Flux
XZZ Tin Paste 138ā 158ā 183ā 199ā Solder Flux For Mobile Phone iPad Tablet Logic Board PCB BGA SMD PGA Welding Desoldering Repair. XZZ low/medium/high temperature leaded/lead-free solder flux paste.Ā
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138ā, 158ā, 183ā, 199ā.
Option:
1. XZZ lead-free low-temperature solder paste 138ā.
2. XZZ lead-free medium-temperature solder paste 158ā, contains silver.
3. XZZ leaded medium-temperature solder paste 183ā, contains silver.
4. XZZ leaded high-temperature solder paste 199ā, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138ā, 158ā, 183ā, 199ā.
Option:
1. XZZ lead-free low-temperature solder paste 138ā.
2. XZZ lead-free medium-temperature solder paste 158ā, contains silver.
3. XZZ leaded medium-temperature solder paste 183ā, contains silver.
4. XZZ leaded high-temperature solder paste 199ā, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
Select Temperature
From $1.05
Original: $2.99
-65%XZZ Lead Free Tin Paste 138/158/183/199ā Solder Fluxā
$2.99
$1.05Product Information
Product Information
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Shipping & Returns
Description
XZZ Tin Paste 138ā 158ā 183ā 199ā Solder Flux For Mobile Phone iPad Tablet Logic Board PCB BGA SMD PGA Welding Desoldering Repair. XZZ low/medium/high temperature leaded/lead-free solder flux paste.Ā
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138ā, 158ā, 183ā, 199ā.
Option:
1. XZZ lead-free low-temperature solder paste 138ā.
2. XZZ lead-free medium-temperature solder paste 158ā, contains silver.
3. XZZ leaded medium-temperature solder paste 183ā, contains silver.
4. XZZ leaded high-temperature solder paste 199ā, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138ā, 158ā, 183ā, 199ā.
Option:
1. XZZ lead-free low-temperature solder paste 138ā.
2. XZZ lead-free medium-temperature solder paste 158ā, contains silver.
3. XZZ leaded medium-temperature solder paste 183ā, contains silver.
4. XZZ leaded high-temperature solder paste 199ā, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
