YCS MR.YANG BGA Reballing Stencil with Platform Kit for iPhone X-17 Pro Max middle layer and A11-A19 Pro CPU soldering repair. The reballing soldering kit includes various stencils designed for replacing and resoldering different circuit boards. It safely and effectively resolders iPhone CPU or mid-frame solder joints, helping to repair iPhone malfunctions caused by solder joint issues. The BGA reballing platform kit supports repairs of mid-layer components from the iPhone X-17 series and CPUs ranging from A11 to A19 Pro.

Option:
1. YCS M.Y iPhone X-17 Pro Max middle layer reballing platform kit: 1x Silicone reballing platform, 7x silicone mold, 24x stencils
2. YCS M.Y A11-A19 Pro CPU reballing kit: 1x Magnetic base, 11x positioning mold, 12x stencils.

Features:
1. Compatible with the iPhone 8-iPhone 17 series, including Pro and Pro Max models;
2. Includes 12 steel stencils, each supporting board-swapping and reballing operations for specific iPhone models;
3. High-precision design ensures exceptional soldering accuracy and stability;
4. Features a magnetic base for rapid positioning and ease of use;
5. Enables intricate soldering work to be performed without the need to completely disassemble the motherboard;
6. Continuously updated to support new iPhone models, ensuring long-term utility and value;
7. Includes a silicone reballing platform for mid-layer boards, enhancing operational convenience and precision.